Overview
Product Director/Senior Manager (Based in Shanghai) Jobs in Hsinchu City, Taiwan, Taiwan at NTI Nanofilm
Title: Product Director/Senior Manager (Based in Shanghai)
Company: NTI Nanofilm
Location: Hsinchu City, Taiwan, Taiwan
Founded in 1999 and headquartered in Singapore, NTI Nanofilm is a global nanotechnology solutions company integrating advanced thin-film coatings, turnkey vacuum coating equipment, micro-optics nanofabrication, and hydrogen fuel-cell surface technologies. With proprietary deposition sources—including Magnetron Sputtering, Arc Evaporation, Filtered Cathodic Vacuum Arc (FCVA), Closed Space Sublimation (CSS), and Plasma-Enhanced CVD (PECVD), we help electronics, automotive, medical and industrial customers improve performance, durability and sustainability, from R&D through high-volume production. NTI Nanofilm operates across Singapore, China, Germany, Japan, India and Vietnam, and has been listed on the Singapore Exchange since 2020.
Job Purpose/职位概要
Responsible for product planning and full lifecycle management of the company’s vacuum coating equipment in the semiconductor and extended semiconductor fields, with particular focus on applications such as TGV, TSV, ESD, and PCB. The role emphasizes integrated deployment of equipment and process capabilities for PVD and ALD coating technologies in precision carriers, PCB metallization, glass through-via coating, and electrostatic discharge protection, ensuring strong market competitiveness and technology leadership.
负责公司在半导体及泛半导体领域（特别是TGV、TSV、ESD 、PCB等应用方向）的真空镀膜设备产品规划与全生命周期管理。聚焦 PVD、ALD 镀膜设备在精密载具、线路板金属化、玻璃通孔镀膜及静电放电防护等场景中的设备与工艺一体化落地，确保产品具备明确的市场竞争力与技术领先性。
Responsibilities/岗位职责
Product Strategy & Planning
- Develop a vacuum-process-centric product roadmap based on semiconductor industry requirements for PVD and ALD coating processes.
- Conduct in-depth analysis of customer vacuum process pain points across target application scenarios, defining clear process specifications and performance boundaries.
- Analyze competitor strategies and product positioning in PVD/ALD equipment and processes, and propose differentiated product strategies.
- Define differentiated equipment and process solution strategies for specific scenarios including coating uniformity, PCB metallization and barrier layers, conformal coating of deep TGV structures, and ESD functional thin films.
Product Development Management (Equipment + Process)
- Lead Product Requirement Definition (PRD) for vacuum coating equipment, covering vacuum systems, chamber design, process control, and automation integration.
- Collaborate with R&D and process teams to drive the full development cycle from concept design and prototype validation to process tuning and mass production release.
- Act as Technical Product Manager (TPM), owning key technical KPIs such as vacuum performance, process consistency, and yield.
- Drive PVD (sputtering, evaporation) and ALD process adaptation for complex substrates (thin carriers, organic substrates, glass through-vias), addressing challenges including film thickness uniformity, step coverage, adhesion, and stress control.
Market Introduction & BD Collaboration
- Work closely with Business Development to engage semiconductor customers, participate in process requirement analysis, sampling方案 design, and technical discussions.
- Rapidly drive product iteration or process parameter optimization based on customer validation feedback, and establish baseline process documentation (BMF/SPEC).
- Support Business Development in defining technical clauses related to equipment capability and process performance within MOUs and Technical Agreements.
Product Lifecycle Management
- Track equipment process adaptability at customer sites, gather feedback on vacuum process deviations and improvement needs during volume production.
- Drive performance upgrades, process extensions, and version iterations throughout the product lifecycle.
- Support Sales and Business Development with product training, technical white papers, and competitive analysis materials.
Industry Insight & Technology Pre-research
- Continuously monitor advancements in vacuum and thin-film technologies, including high-vacuum systems, plasma enhancement, PEALD, and high-power impulse magnetron sputtering.
- Participate in industry standards development, patent strategy, and technology alliances to strengthen the company’s influence in PVD/ALD niche application areas.
产品战略与规划
- 结合半导体行业对PVD/ALD镀膜工艺的需求，制定以真空工艺能力为核心的产品路线图。
- 深入分析目标客户在TGV、TSV、ESD 、PCB等场景中的真空工艺痛点，明确产品工艺指标与性能边界。
- 分析竞争对手在PVD/ALD设备及工艺上的布局，提出差异化产品策略。
- 针对均匀性镀膜、PCB的金属化与阻挡层、TGV的深孔保形镀膜、ESD功能薄膜 等细分场景，制定差异化的设备与工艺解决方案策略。
产品开发管理（设备+工艺）
- 主导真空镀膜设备的产品需求定义（PRD），涵盖真空系统、腔体设计、工艺控制、自动化集成等关键模块。
- 协同研发与工艺团队，推动设备从概念设计、原型验证到工艺调试、量产释放的全流程。
- 作为TPM（技术产品经理），对设备开发中的真空性能、工艺一致性、良率等核心技术指标负责。
- 重点推动 PVD（溅射、蒸镀）与ALD（原子层沉积） 在复杂基材（如薄型载具、有机基板、玻璃通孔）上的工艺适配性开发，解决膜厚均匀性、台阶覆盖率、附着力与应力控制等关键工艺问题。
与BD协同市场导入
- 与BD经理共同对接半导体客户，参与客户真空工艺需求调研、打样方案设计及技术交流。
- 根据BD反馈的客户工艺验证结果，快速推动产品迭代或工艺参数优化，并形成工艺基线文件（BMF/SPEC）。
- 支持BD完成技术协议（MOU/TA）中与设备能力、工艺指标相关的条款制定。
产品生命周期管理
- 负责真空镀膜设备在客户端的工艺适配性跟踪，收集批量生产中的真空工艺异常与改进需求。
- 推动设备在寿命周期内的性能升级、工艺扩展与版本迭代。
- 支持销售与BD团队完成产品培训、技术白皮书、竞品分析等材料。
行业洞察与技术预研
- 持续跟踪真空及薄膜技术前沿（如高真空、等离子体增强、PEALD、高功率脉冲磁控溅射等）。
- 参与行业标准、专利布局与技术联盟建设，提升公司产品在PVD/ALD细分应用领域的话语权。
- 持续跟踪真空技术前沿（如高真空、超高真空、等离子体增强、原子层沉积等）。
- 参与行业标准、专利布局与技术联盟建设，提升公司产品话语权。
Requirements/任职资格
- Bachelor’s degree or above in Microelectronics, Materials Science, Physics, Mechanical Engineering, Electrical Engineering, or related fields.
- Minimum 10 years of experience in semiconductor or extended semiconductor equipment industries, with at least 3 years in a Product Manager or Technical Product Manager (TPM) role, and direct involvement in PVD or ALD equipment development and process tuning.
- Strong understanding of vacuum system principles; hands-on experience with PVD (mandatory) and ALD (preferred) coating technologies, including process mechanisms, equipment implementation, and process windows.
- Practical experience in key thin-film metrics such as film uniformity, stress, density, and step coverage.
- Experience benchmarking competitor equipment and products is preferred.
- Prior product or process deployment experience in any of the following areas is a strong advantage: TSV metallization, PCB/FPC metallization, TGV glass via coating, ESD functional thin films.
- Strong technical comprehension combined with market-driven product definition capability; able to produce high-quality PRDs.
- Solid project management capabilities with proven cross-functional collaboration across R&D, Business Development, and Operations.
- Customer-oriented mindset with willingness to engage in frequent customer visits and technical support activities.
- Strong learning agility and resilience, able to perform effectively in a fast-paced semiconductor industry environment.
- 本科及以上学历，微电子、材料、物理、机械、电气等相关专业。
- 10年以上半导体或泛半导体设备行业经验，其中至少3年以上产品经理或技术产品经理（TPM）经验，且直接参与过PVD或ALD设备的开发与工艺调试。
- 深入理解真空系统原理，熟练掌握PVD（必选）和ALD（优选）两种镀膜工艺的机理、设备实现方式及工艺窗口，对膜层均匀性、应力、致密度、台阶覆盖率等关键指标有实际调试经验。
- 有对标竞品公司产品经验者优先。
- 具备以下任一领域的产品或工艺落地经验者优先： TSV 硅通孔镀膜、PCB/FPC金属化、TGV玻璃通孔镀膜、ESD功能薄膜。
- 具备优秀的技术理解力与市场需求转化能力，能撰写高质量PRD。
- 具备良好的项目管理能力，能推动跨部门（研发、BD、运营）协作。
- 具备客户导向思维，能适应与BD一同高频客户拜访与技术支持。
- 具备较强的学习能力与抗压能力，能适应快节奏的半导体行业环境。
Working Location
上海市青浦区崧辉路399号
