Overview
Head of Research And Development Jobs in Ipoh, Perak, Malaysia at Carsem (M) Sdn. Bhd.
Title: Head of Research And Development
Company: Carsem (M) Sdn. Bhd.
Location: Ipoh, Perak, Malaysia
About the Role
Carsem is a global semiconductor assembly and test leader with more than 30 years in power packaging and over 15 years of copper-clip development. As wide-bandgap (SiC and GaN) devices reshape power electronics for automotive, industrial, AI and computing, we are seeking an accomplished Head of Research & Development to set and drive the strategic technical direction of the company and the Carsem Technology Center (CTC).
This is an executive leadership role accountable for the formulation and execution of our power-packaging R&D strategy — from advanced die-attach and interconnect technologies, through modeling and simulation, to the efficient management of the R&D pilot line. Reporting to the General Manager – WBG, you will lead innovation and commercialization that keep Carsem’s power-packaging technology among the industry’s best and accelerate our customers’ time-to-market.
Key Responsibilities
- Own the power-packaging technology strategy — Define and drive Carsem’s R&D and technology roadmap for wide-bandgap (SiC and GaN) power semiconductor packaging, keeping the company at the leading edge of power module and power discrete solutions.
- Lead advanced power-packaging development — Direct development and industrialization of next-generation interconnect and assembly technologies including silver/copper sinter die attach, copper clip, wire/ribbon bonding, DBC/AMB substrates, encapsulation, and advanced thermal-management solutions for high-power, high-temperature SiC/GaN applications.
- Commercialize innovation — Take new packages, materials, and processes from concept through pilot line to qualified mass production, enabling fast time-to-market at optimum cost for automotive, industrial, AI and computing power applications.
- Run the R&D pilot line — Oversee efficient pilot-line operations, modeling and simulation, and continuous improvement to de-risk technology transfer into high-volume manufacturing at M-site and S-site.
- Partner with customers — Serve as the senior technical face to customers on new product, material, and process development, delivering “deep dive” presentations and co-developing power-packaging solutions for demanding reliability and mission-profile requirements.
- Drive value engineering — Establish critical internal capabilities and lead value-engineering and materials cost-reduction initiatives without compromising power-cycling, thermal, or long-term reliability performance.
- Protect and grow IP — Manage patent and intellectual-property strategy and procedures across Carsem M-site and S-site.
- Build and lead the organisation — Develop, mentor and lead a multidisciplinary R&D organisation (through Cluster Managers and engineering teams), building internal power-packaging capability and a strong technical bench.
- Align technology with the business — Advise senior management on technology developments affecting profit, schedule, cost, quality, and customer relations, and ensure the technical strategy supports long-term business growth.
- Scan the horizon — Maintain deep working knowledge of emerging WBG device, materials, and packaging trends, recommending adoption to grow into new market segments.
Essential Requirements
- Extensive senior R&D / technology-development leadership in semiconductor packaging, with a clear track record in power packaging (power modules and/or power discretes).
- Direct experience with wide-bandgap (SiC and/or GaN) power device packaging, or closely adjacent high-power packaging with demonstrable ability to lead WBG programs.
- Deep command of assembly & test processes, IC/power packaging and materials, and the reliability physics of high-power, high-temperature packages.
- Proven success industrializing new packages from development through qualification to mass production (NPI), including automotive-grade qualification where applicable.
- Strong project management to mass production, budgeting and business planning, and lean-manufacturing / operations knowledge.
- Demonstrated people leadership at scale — leading managers and multidisciplinary teams, with accountability for performance, resourcing, and development.
- Bachelor’s Degree in Electrical & Electronic Engineering, Physics, Materials, Computer Science, Software Engineering, or equivalent; a postgraduate qualification is an advantage.
